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STP08CP05MTR(2007) 데이터 시트보기 (PDF) - STMicroelectronics

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STP08CP05MTR
(Rev.:2007)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STP08CP05MTR Datasheet PDF : 25 Pages
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STP08CP05
Figure 12. Power dissipation vs temperature package
Typical characteristics
Note:
The Exposed-Pad should be soldered to the PBC to realize the thermal benefits.
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