ESDALC6V1W5(2002) 데이터 시트보기 (PDF) - STMicroelectronics
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ESDALC6V1W5 Datasheet PDF : 9 Pages
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ESDALC6V1W5
PACKAGE MECHANICAL DATA
SOT323-5L
DIMENSIONS
A
A2
REF.
Millimeters
Inches
Min. Max. Min. Max.
A1
A
0.8
1.1 0.031 0.043
A1
0
0.1
0
0.004
D
e
e
A2
0.8
1
0.031 0.039
b
0.15
0.3 0.006 0.012
c
0.1
0.18 0.004 0.007
D
1.8
2.2 0.071 0.086
H
E
E
1.15 1.35 0.045 0.053
e
0.65 Typ.
0.026 Typ.
Q1
c
b
H
1.8
2.4 0.071 0.094
Q1
0.1
0.4 0.004 0.016
FOOT PRINT (in millimeters)
0.3mm
1mm
2.9mm
1mm
0.35mm
Mechanical specifications
Lead plating
Tin-lead
Lead plating thickness 5µm min.
25 µm max.
Lead material
Sn / Pb
(70% to 90% Sn)
Lead coplanarity
10µm max.
Body material
Molded epoxy
Epoxy meets
UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
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© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
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