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NCV8705(2014) 데이터 시트보기 (PDF) - ON Semiconductor

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NCV8705 Datasheet PDF : 20 Pages
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NCV8705
VIN
IN
OUT
NCV8705
1 mF CIN
EN
ADJ
ON
GND
OFF
R1 C1
R2
VOUT
COUT
1 mF
Internal Soft−Start circuit
NCV8705 contains an internal soft−start circuitry to
protect against large inrush currents which could otherwise
flow during the start−up of the regulator. Soft−start feature
protects against power bus disturbances and assures a
controlled and monotonic rise of the output voltage.
Figure 65. NCV8705 Adjustable with Noise
Improvement Capacitor
Enable Operation
The NCV8705 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCV8705 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 110 nA which assures that the device is
turned−off when the EN pin is not connected. Build in 2 mV
hysteresis into the EN prevents from periodic on/off
oscillations that can occur due to noise.
In the case where the EN function isn’t required the EN
should be tied directly to IN.
Undervoltage Lockout
The internal UVLO circuitry assures that the device
becomes disabled when the VIN falls below typ. 1.5 V. When
the VIN voltage ramps−up the NCV8705 becomes enabled, if
VIN rises above typ. 1.6 V. The 100 mV hysteresis prevents
from on/off oscillations that can occur due to noise on VIN line.
Output Current Limit
Output Current is internally limited within the IC to a
typical 750 mA. The NCV8705 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 800 mA (typ). The current limit and
short circuit protection will work properly up to
VIN = 5.5 V at TA = 125°C. There is no limitation for the
short circuit duration.
220
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD − 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140°C typical).
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCV8705 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCV8705 can
handle is given by:
ƪ ƫ TJ(MAX) * TA
PD(MAX) +
qJA
(eq. 3)
The power dissipated by the NCV8705 for given
application conditions can be calculated from the following
equations:
PD [ VINǒIGND@IOUTǓ ) IOUTǒVIN * VOUTǓ (eq. 4)
1.6
200
1.4
PD(MAX), TA = 25°C, 2 oz Cu
180
1.2
160
1
PD(MAX), TA = 25°C, 1 oz Cu
140
0.8
qJA, 1 oz Cu
120
0.6
100
qJA, 2 oz Cu
0.4
80
0
0.2
100 200 300 400 500 600 700
COPPER HEAT SPREADER AREA (mm2)
Figure 66. qJA and PD(MAX) vs. Copper Area (WDFN6)
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