HV5308 / HV5408
44-Lead PLCC Package Outline (PJ)
.653x.653in body, .180in height (max), .050in pitch
.048/.042 x 45O
6
D
D1
1 44
40
.056/.042 x 45O
.150 MAX
.075 MAX
Note 1
(Index Area)
E1 E
.020max
(3 Places)
Note 2
Top View
Vertical Side View
A
A2
A1
e
Horizontal Side View
View B
Base .020 MIN
Plane
Seating
Plane
b1
b
R
View B
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Notes:
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a printed indicator.
2. $FWXDOVKDSHRIWKLVIHDWXUHPD\YDU\
Symbol
A
A1
A2
b
MIN .165 .090 .062 .013
Dimension
(inches)
NOM
.172
.105
-
-
MAX .180 .120 .083 .021
JEDEC Registration MS-018, Variation AC, Issue A, June, 1993.
† This dimension differs from the JEDEC drawing.
Drawings not to scale.
b1
.026
-
.036†
D
.685
.690
.695
D1
.650
.653
.656
E
.685
.690
.695
E1
.650
.653
.656
e
.050
BSC
R
.025
.035
.045
2015 Microchip Technology Inc.
DS20005425A-page 13