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X76F102H 데이터 시트보기 (PDF) - IC MICROSYSTEMS

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X76F102H
ICMIC
IC MICROSYSTEMS ICMIC
X76F102H Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
X76F102
ORDERING INFORMATION
Device
X76F102 P T G -V
VCC Limits
Blank = 5V ±10%
2.0 = 2.0V to 5.5V
G=RoHS Compliant Lead Free package
Blank = Standard package. Non lead free
Temperature Range
Blank = Commercial = 0°C to +70°C
I = Industrial= –40°C to +85°C
Part Mark Convention
Package
S8 = 8-Lead SOIC
M8 = 8-Lead MSOP
P = 8-Lead PDIP
V8 - 8-Lead TSSOP
H = Die in Waffle Packs
W = Die in Wafer Form
X = Smart Card Module
8-Lead MSOP
EYWW
XXX
8-Lead SOIC/PDIP
X76F102 XG
XX
Blank = 8-Lead SOIC
G = RoHS compliant lead free
ACG = 2.0 to 5.5V, 0 to +70°C
ACH = 2.0 to 5.5V, -40 to +85°C
ABS = 4.5 to 5.5V, 0 to +70°C
ABT = 4.5 to 5.5V, -40 to +85°C
LIMITED WARRANTY
F = 2.0 to 5.5V, 0 to +70°C
G = 2.0 to 5.5V, -40 to +85°C
Blank = 4.5 to 5.5V, 0 to +70°C
I = 4.5 to 5.5V, -40 to +85°C
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only.
Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding
the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness for any
purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without
notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other
circuits, patents, licenses are implied.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265;
4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652;
4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the
system with appropriate error detection and correction, redundancy and back-up features to prevent such an occurrence.
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