ISL59446 데이터 시트보기 (PDF) - Renesas Electronics
부품명
상세내역
제조사
ISL59446 Datasheet PDF : 14 Pages
| |||
ISL59446
• Maximize use of AC decoupled PCB layers. All signal I/O lines
should be routed over continuous ground planes (i.e., no split
planes or PCB gaps under these lines). Avoid vias in the signal
I/O lines.
• Use proper value and location of termination resistors.
Termination resistors should be as close to the device as
possible.
• When testing use good quality connectors and cables,
matching cable types and keeping cable lengths to a
minimum.
• Minimum of 2 power supply decoupling capacitors are
recommended (1000pF, 0.01µF) as close to the devices as
possible - avoid vias between the cap and the device because
vias add unwanted inductance. Larger caps can be further
away. When vias are required in a layout, they should be routed
as far away from the device as possible.
• The NIC pins are placed on both sides of the input pins. These
pins are not internally connected to the die. It is recommended
these pins be tied to ground to minimize crosstalk.
The QFN Package Requires Additional PCB
Layout Rules for the Thermal Pad
The thermal pad is electrically connected to V- supply through the
high resistance IC substrate. Its primary function is to provide
heat sinking for the IC. However, because of the connection to
the V- supply through the substrate, the thermal pad must be tied
to the V- supply to prevent unwanted current flow to the thermal
pad. Do not tie this pin to GND as this could result in large back
biased currents flowing between GND and V-. The ISL59446
package has pad dimensions of D2 = 2.48mm and E2 = 3.4mm.
Maximum AC performance is achieved if the thermal pad is
attached to a dedicated decoupled layer in a multi-layered PC
board. In cases where a dedicated layer is not possible, AC
performance may be reduced at upper frequencies.
• The thermal pad requirements are proportional to power
dissipation and ambient temperature. A dedicated layer
eliminates the need for individual thermal pad area. When a
dedicated layer is not possible a 1” x 1” pad area is sufficient
for the ISL59446 that is dissipating 0.5W in +50°C ambient
temperature. Pad area requirements should be evaluated on a
case-by-case basis.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to
make sure you have the latest Rev.
DATE
REVISION
CHANGE
July 31, 2014
FN6261.3
Added Revision History.
Electrical Spec Table on page 4 - made 3 limit changes as follows:
+Is Enabled MAX from 48 to 50mA
+Is Disabled MAX from 3.8 to 4mA
-Is Enabled MIN from -45mA to -46mA
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
© Copyright Intersil Americas LLC 2006-2014. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6261 Rev 3.00
July 31, 2014
Page 13 of 14
Share Link: 