ISL59448
Typical Performance Curves VS = ±5V, RL = 500 to GND, TA = 25°C, unless otherwise specified. (Continued)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
1.2
1.136W
1
0.8
QSOP24
JA=88°C/W
0.6
0.4
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 25. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
1.2 CONDUCTIVITY TEST BOARD
1
870mW
0.8
0.6
QSOP24
JA=115°C/W
0.4
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 26. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FN6160 Rev 2.00
March 29, 2006
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