ADP122(Rev0) 데이터 시트보기 (PDF) - Analog Devices

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ADP122
(Rev.:Rev0)

5.5 V Input, 300 mA, Low Quiescent Current, CMOS Linear Regulator

Analog Devices 

ADP122/ADP123

140

120

100

80

60

ILOAD = 1mA

ILOAD = 150mA

ILOAD = 10mA

ILOAD = 250mA

ILOAD = 50mA

ILOAD = 300mA

40

ILOAD = 100mA TJ MAX

20

0

0.4

0.8

1.2

1.6

2.0

2.4

2.8

VIN – VOUT (V)

Figure 40. Junction Temperature vs. Power Dissipation,

Board Temperature = 85°C

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP122/ADP123.

However, as shown in Table 6, a point of diminishing returns

eventually is reached, beyond which an increase in the copper

size does not yield significant heat dissipation benefits.

The input capacitor should be placed as close as possible to the

VIN and GND pins, and the output capacitor should be placed

as close as possible to the VOUT and GND pins. Use of 0402 or

0603 size capacitors and resistors achieves the smallest possible

footprint solution on boards where the area is limited.

Rev. 0 | Page 16 of 20

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