GaAs Components
Soldering Recommendation
• Foot Print
• Soldering
Soldering profile:
Ramp-up preheating
Ramp-up peak
Exposure to molten solder
Typ. solder temperature
Peak temperature
Ramp-down
Comments
• Solder Paste Thickness
• Control of Soldering (voids)
• JEDEC A-112A
• IPC-9501 (IPC-4202)
CGY 98
Drawing C63060-A2120-A001-01-0027
Wave soldering: unsuitable
Reflow soldering: suitable, max. 3 times
(IR or VPR)
Temperature gradient: max. + 2 K/s
Time at 100 - 150 °C: min. 90 s
Temperature gradient: max. + 6 K/s
Above 183 °C
max. 150 s
Typ. 215 - 245 °C max. 30 s
Max. peak 260 °C max. 10 s
Temperature gradient: min. – 6 °C/s
(see also soldering standard profile of data book
“Package information”)
Slow ramp-up, long preheating phase and low max.
temperature recommended
150 - 200 µm
- Visual inspection
- Cross sectioning
- Measurement of case temperature /
thermal resistance case to ambient
Level 1 storage floor life at 30 °C / 90%
unlimited
Level 111 storage floor life at 30 °C / 60%
unlimited
IR/Convection; max. 245 °C; < 6 K/s
Data Sheet
14
2001-01-01