MAX703/MAX704
Chip Topography
0.070”
[1.778mm]
VOUT
VBATT
VCC
RESET
WDI
0.065”
[1.651mm]
Low-Cost Microprocessor Supervisory
Circuits with Battery Backup
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
8 PDIP
8 SO
8 CERDIP
PACKAGE
CODE
P8+1
S8+2
J8+2
OUTLINE
NO.
21-0043
21-0041
21-0045
LAND
PATTERN NO.
—
90-0096
—
GND
PFI PFO
SUBSTRATE MUST BE LEFT UNCONNECTED
www.maximintegrated.com
Maxim Integrated │ 9