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HCS112HMSR 데이터 시트보기 (PDF) - Intersil
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HCS112HMSR
Radiation Hardened Dual JK Flip-Flop
Intersil
HCS112HMSR Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
KA
(2)
HCS112MS
HCS112MS
CP1
(1)
VCC
(16)
JA (3)
SA (4)
QA (5)
QA (6)
(15) RA
(14) RB
(13) CPB
(12) KB
QB (7)
(11) JB
(8)
(9)
(10)
GND
QB
SB
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS112 is TA14341A.
Spec Number
518830
19
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