MSA-0500 데이터 시트보기 (PDF) - HP => Agilent Technologies
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MSA-0500 Datasheet PDF : 4 Pages
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MSA-0500 Chip Dimensions[1]
3
5
2
1
570 µm
22.4 mil
2
4
530 µm
20.8 mil
Unless otherwise specified, tolerances are
±13 µm/±0.5 mils. Chip thickness is 114 µm/4.5 mil.
Bond Pads are 41 µm/1.6 mil typical on each side.
Note 1: Output contact is made by die attaching the
backside of the die.
6-349
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