MAX4800ACXZ 데이터 시트보기 (PDF) - Maxim Integrated

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MAX4800ACXZ

Low-Charge-Injection, 8-Channel, High-Voltage Analog Switches with 20MHz Serial Interface

Maxim Integrated 

MAX4800A/MAX4802A

Low-Charge-Injection, 8-Channel, High-Voltage

Analog Switches with 20MHz Serial Interface

Absolute Maximum Ratings

(All voltages referenced to GND.)

VDD Logic Supply Voltage........................................-0.3V to +7V

VPP - VNN Supply Voltage...................................................220V

VPP Positive Supply Voltage.................... -0.3V to (VNN + 220V)

VNN Negative Supply Voltage..............................+0.3V to -220V

Logic Inputs LE, CLR, CLK, DIN..............................-0.3V to +7V

DOUT........................................................ -0.3V to (VDD + 0.3V)

RGND (MAX4802A)..............................................-4.5V to +0.3V

COM_, NO_............................................................... VNN to VPP

Continuous Power Dissipation (TA = +70°C)

26-Bump CSBGA (derate 11.8mW/°C above +70°C)..... 941mW

28-Pin PLCC (derate 10.5mW/°C above +70°C).........842mW

48-Pin LQFP (derate 22.7mW/°C above +70°C).......1818mW

Operating Temperature Range................................0°C to +70°C

Storage Temperature Range............................. -65°C to +150°C

Junction Temperature.......................................................+150°C

Lead Temperature (excluding CSBGA, soldering, 10s)... +300°C

Soldering Temperature (reflow)

28 PLCC.......................................................................+245°C

All other packages........................................................ +260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

PACKAGE TYPE: 26 CSBGA

Package Code

Outline Number

Land Pattern Number

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction to Ambient (θJA)

Junction to Case (θJC)

X07265+1

21-0158

90-0184

85°C/W

23°C/W

PACKAGE TYPE: 28 PLCC

Package Code

Outline Number

Land Pattern Number

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction to Ambient (θJA)

Junction to Case (θJC)

Q28+13

21-0049

90-0235

44°C/W

10°C/W

PACKAGE TYPE: 48 LQFP

Package Code

C48+6

Outline Number

21-0054

Land Pattern Number

90-0093

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction to Ambient (θJA)

Junction to Case (θJC)

44°C/W

10°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

www.maximintegrated.com

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