10. Ordering Information
Atmel Ordering Code
AT24C01D-SSHM-T(1)
AT24C01D-SSHM-B(2)
AT24C01D-XHM-T(1)
AT24C01D-XHM-B(2)
AT24C01D-MAHM-T(1)
AT24C01D-PUM
AT24C01D-STUM-T(1)
AT24C01D-CUM-T(1)
AT24C01D-WWU11M(3)
Lead Finish
NiPdAu
(Lead-free/Halogen-free)
Matte Tin
(Lead-free/Halogen-free)
SnAgCu Ball
(Lead-free/Halogen-free)
N/A
Package
8S1
8X
8MA2
8P3
5TS1
8U3-1
Wafer Sale
AT24C02D-SSHM-T(1)
AT24C02D-SSHM-B(2)
AT24C02D-XHM-T(1)
AT24C02D-XHM-B(2)
AT24C02D-MAHM-T(1)
NiPdAu
(Lead-free/Halogen-free)
8S1
8X
8MA2
AT24C02D-PUM
AT24C02D-STUM-T(1)
Matte Tin
(Lead-free/Halogen-free)
8P3
5TS1
AT24C02D-CUM-T(1)
AT24C02D-WWU11M(3)
SnAgCu Ball
(Lead-free/Halogen-free)
N/A
8U3-1
Wafer Sale
Notes: 1. T = Tape and reel:
SOIC = 4K units per reel
TSSOP, UDFN, and SOT23 = 5K units per reel
2. B = Bulk
SOIC and TSSOP = 100 units per tube
PDIP = 50 units per tube
3. For wafer sales, please contact Atmel Sales.
Voltage
1.7V to 3.6V
1.7V to 3.6V
Operation Range
Industrial Temperature
(–40C to 85C)
Industrial Temperature
(–40C to 85C)
8S1
8X
8MA2
8P3
5TS1
8U3-1
Package Type
8-lead, 0.15” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-pad, 2.00mm x 3.00mm body, 0.50mm Pitch, Ultra Thin Dual Flat No Lead (UDFN)
8-lead, 0.30” wide, Plastic Dual Inline Package (PDIP)
5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)
8-ball, 1.50mm x 2.00mm body, 0.5mm pitch, Very thin Fine Ball Grid Array (VFBGA)
AT24C01D and AT24C02D [DATASHEET] 17
Atmel-8871B-SEEPROM-AT24C01D-02D-Datasheet_032014