EMIF02-USB03F2
Figure 11: Order Code
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
Figure 12: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
650µm ± 65
1.57mm ± 50µm
Figure 14: Foot Print Recommendations
Copper pad Diameter :
250µm recommended, 300µm max.
Solder stencil opening :
330µm recommended
Solder mask opening recommendation :
340µm min. for 300µm copper pad diameter
Figure 15: Marking
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
(y = year
ww = week)
All dimensions in µm
565
400
E
xxz
y ww
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