HV582 데이터 시트보기 (PDF) - Microchip Technology

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HV582

96-Channel Serial to Parallel Converter with Push-Pull Outputs

Microchip Technology 

HV582

169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA]

(Complies with JEDEC Terminal Assignment recommendations)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

C1

1

2 3 4 5 6 7 8 9 10 11 12 13

A

B

C

D

E

F

C2

G

H

J

K

L

M

N

E

Øb

SILK SCREEN

RECOMMENDED LAND PATTERN

Units

Dimension Limits

Contact Pitch

E

Contact Pad Spacing

C1

Contact Pad Spacing

C2

Contact Pad Diameter (X169)

b

MILLIMETERS

MIN

NOM

MAX

0.75 BSC

9.00

9.00

0.35

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2377-J Rev C

DS20005455A-page 14

 2015 Microchip Technology Inc.

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