Nexperia
PSMN005-30K
N-channel TrenchMOS SiliconMAX logic level FET
5. Thermal characteristics
Table 5.
Symbol
Rth(j-sp)
Thermal characteristics
Parameter
thermal resistance from
junction to solder point
Conditions
mounted on a metal clad board ;
see Figure 4
Min Typ Max Unit
-
-
20 K/W
102
Zth(j-sp)
(K/W)
03ah04
10 δ = 0.5
0.2
0.1
1 0.05
0.02
10−1
10−4
single pulse
10−3
10−2
10−1
P
δ = tp
T
tp
t
T
1
10
tp (s)
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
PSMN005-30K
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 22 December 2011
© Nexperia B.V. 2017. All rights reserved
4 of 13