NCS2003 데이터 시트보기 (PDF) - ON Semiconductor

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NCS2003

Operational Amplifiers, High Slew Rate, Low Voltage, Rail-to-Rail Output

ON Semiconductor 

NCS2003/A, NCV2003, NCS20032, NCV20032, NCS20034, NCV20034

PACKAGE DIMENSIONS

D

−X−

5

4

12 3

E

−Y−

b 5 PL

e

0.08 (0.003) M X Y

SOT−553, 5 LEAD

CASE 463B

ISSUE C

A

L

HE

c

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

MILLIMETERS

DIM MIN NOM MAX

A 0.50

0.55

0.60

b

0.17

0.22

0.27

c

0.08

0.13

0.18

D 1.55

1.60

1.65

E

1.15

1.20

1.25

e

0.50 BSC

L

0.10

0.20

0.30

H E 1.55

1.60

1.65

MIN

0.020

0.007

0.003

0.061

0.045

0.004

0.061

INCHES

NOM

0.022

0.009

0.005

0.063

0.047

0.020 BSC

0.008

0.063

MAX

0.024

0.011

0.007

0.065

0.049

0.012

0.065

RECOMMENDED

SOLDERING FOOTPRINT*

0.3

0.0118

1.35

0.0531

1.0

0.0394

0.45

0.0177

0.5 0.5

0.0197 0.0197

ǒ Ǔ SCALE 20:1

mm

inches

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

13

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