AT91M40800(2002) 데이터 시트보기 (PDF) - Atmel Corporation

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AT91M40800
(Rev.:2002)

AT91 ARM® Thumb® Microcontrollers

Atmel Corporation 

AT91M40800

Soldering Profile

Table 8 gives the recommended soldering profile from J-STD-20.

Table 8. Soldering Profile

Average Ramp-up Rate (183°C to Peak)

Preheat Temperature 125°C ±25°C

Temperature Maintained Above 183°C

Time within 5°C of Actual Peak Temperature

Peak Temperature Range

Ramp-down Rate

Time 25°C to Peak Temperature

Convection or

IR/Convection

3°C/sec. max.

120 sec. max

60 sec. to 150 sec.

10 sec. to 20 sec.

220 +5/-0°C or

235 +5/-0°C

6°C/sec.

6 min. max

VPR

10°C/sec.

60 sec.

215 to 219°C or

235 +5/-0°C

10°C/sec.

Small packages may be subject to higher temperatures if they are reflowed in boards

with larger components. In this case, small packages may have to withstand tempera-

tures of up to 235°C, not 220°C (IR reflow).

Recommended package reflow conditions depend on package thickness and volume.

See Table 9.

Table 9. Recommended Package Reflow Conditions

Parameter

Temperature

Convection

235 +5/-0°C

VPR

235 +5/-0°C

IR/Convection

235 +5/-0°C

When certain small thin packages are used on boards without larger packages, these

small packages may be classified at 220°C instead of 235°C.

Notes:

1. The packages are qualified by Atmel by using IR reflow conditions, not convection or

VPR.

2. By default, the package level 1 is qualified at 220°C (unless 235°C is stipulated).

3. The body temperature is the most important parameter but other profile parameters

such as total exposure time to hot temperature or heating rate may also influence

component reliability.

A maximum of three reflow passes is allowed per component.

17

1348DS–ATARM–02/02

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