ADSP-BF538(Rev0) 데이터 시트보기 (PDF) - Analog Devices

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ADSP-BF538
(Rev.:Rev0)

Blackfin® Embedded Processor

Analog Devices 

ADSP-BF538/ADSP-BF538F

SURFACE MOUNT DESIGN

Table 39 is provided as an aid to PCB design. For industry-

standard design recommendations, refer to IPC-7351,

Generic Requirements for Surface Mount Design and Land Pattern Standard.

Table 39. BGA Data for Use with Surface Mount Design

Package

Solder Mask

Ball Attach Type Opening

Ball Pad Size

316-Ball Mini Ball Grid Array Solder Mask Defined 0.40 mm diameter 0.50 mm diameter

(BC-316)

ORDERING GUIDE

Model 1

Temperature Instruction Flash

Range2

Rate (Max) Memory

ADSP-BF538BBCZ-4A –40ЊC to +85ЊC 400 MHz N/A

ADSP-BF538BBCZ-5A –40ЊC to +85ЊC 533 MHz N/A

ADSP-BF538BBCZ-4F4 –40ЊC to +85ЊC 400 MHz 512K byte

ADSP-BF538BBCZ-4F8

ADSP-BF538BBCZ-5F4

ADSP-BF538BBCZ-5F8

–40ЊC to +85ЊC 400 MHz

–40ЊC to +85ЊC 533 MHz

–40ЊC to +85ЊC 533 MHz

1M byte

512K byte

1M byte

1 Z = RoHS Compliant Part.

2 Referenced temperature is ambient temperature.

Operating Voltage

(Nominal)

Package Description

1.2 V internal/ 2.5 V or 3.3 V I/O 316-Ball Mini BGA

1.25 V internal/ 2.5 V or 3.3 V I/O 316-Ball Mini BGA

1.2 V internal/ 3.0 V or 3.3 V I/O 316-Ball Mini BGA

1.2 V internal/ 3.0 V or 3.3 V I/O 316-Ball Mini BGA

1.25 V internal/ 3.0 V or 3.3 V I/O 316-Ball Mini BGA

1.25 V internal/ 3.0 V or 3.3 V I/O 316-Ball Mini BGA

Package

Option

BC-316

BC-316

BC-316

BC-316

BC-316

BC-316

©2007 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D06700-0-5/07(0)

Rev. 0 | Page 56 of 56 | May 2007

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