STW8C12C-S1 데이터 시트보기 (PDF) - SEOUL SEMICONDUCTOR

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STW8C12C-S1

Mid-Power LED

SEOUL SEMICONDUCTOR 

Product Data Sheet

STW8C12C-S1 (S1W0-3030XX8003-00000X00-00003) – Mid-Power LED

Reflow Soldering Characteristics

Table 7.

Profile Feature

Average ramp-up rate (Tsmax to Tp)

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (Tsmin to Tsmax) (ts)

Time maintained above:

- Temperature (TL)

- Time (tL)

Peak Temperature (Tp)

Time within 5°C of actual Peak

Temperature (tp)2

Ramp-down Rate

Time 25°C to Peak Temperature

IPC/JEDEC J-STD-020

Sn-Pb Eutectic Assembly

3° C/second max.

100 °C

150 °C

60-120 seconds

183 °C

60-150 seconds

215℃

10-30 seconds

6 °C/second max.

6 minutes max.

Pb-Free Assembly

3° C/second max.

150 °C

200 °C

60-180 seconds

217 °C

60-150 seconds

260℃

20-40 seconds

6 °C/second max.

8 minutes max.

Caution

(1) Reflow soldering is recommended not to be done more than two times. In the case of more than

24 hours passed soldering after first, LEDs will be damaged.

(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,

suitable tools must be used.

(3) Die slug is to be soldered.

(4) When soldering, do not put stress on the LEDs during heating.

(5) After soldering, do not warp the circuit board.

Rev 1.2, Oct, 2020

18

www.seoulsemicon.com

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