STQ1NE10L
THERMAL DATA
Rthj-Lead Thermal Resistance Junction-Lead
Max
40
Rthj-amb Thermal Resistance Junction-ambient
Max
125
Tl
Maximum Lead Temperature For Soldering Purpose
Typ
260
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ.
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
100
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16 V
°C/W
°C/W
°C
Max.
Unit
V
1
µA
10
µA
±100
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
VGS = 5 V
ID = 0.5 A
ID = 0.5 A
Min.
1
Typ.
0.30
0.35
Max.
2.5
0.40
0.45
Unit
V
Ω
Ω
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 15V
ID = 0.5 A
VDS = 25V f = 1 MHz VGS = 0
Min.
Typ.
2
345
45
20
Max.
Unit
S
pF
pF
pF
2/9