ELH0101/883 데이터 시트보기 (PDF) - Elantec -> Intersil

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ELH0101/883

Power Operational Amplifier

Elantec -> Intersil 

ELH0101 883 8508901 2YX

Power Operational Amplifier

Applications Information Contd

Every attempt should be made to achieve a sin-

gle point ground system as shown in the figure

below

0101 – 14

Bypass capacitor CBX should be used if the lead

lengths of bypass capacitors CB are long If a sin-

gle point ground system is not possible keep sig-

nal load and power supply from intermingling

as much as possible For further information on

proper grounding techniques refer to ‘‘Grounding

and Shielding Techniques in Instrumentation’’

by Morrison and ‘‘Noise Reduction Techniques

in Electronic Systems’’ by Ott (both published

by John Wiley and Sons)

Leads or PC board traces to the supply pins

short circuit current limit pins and the output

pin must be substantial enough to handle the

high currents that the ELH0101 is capable of

producing

Short Circuit Current Limiting

Should current limiting of the output not be nec-

essary SCa should be shorted to Va and SCb

should be shorted to Vb Remember that the

short circuit current limit is dependent upon the

total resistance seen between the supply and cur-

rent limit pins This total resistance includes the

desired resistor plus leads PC Board traces and

solder joints Assuming a zero TCR current lim-

it resistor typical temperature coefficient of the

short circuit will be approximately 0 3%

Thermal Resistance

The thermal resistance between two points of a

conductive system is expressed as

i12

e

T1 b T2

PD

C

W

(1)

where subscript order indicates the direction of

heat flow A simplified heat transfer circuit for a

cased semiconductor and heatsink system is

shown in the figure below

The circuit is valid only if the system is in ther-

mal equilibrium (constant heat flow) and there

are indeed single specific temperatures TJ TC

and TS (no temperature distribution in junction

case or heatsink) Nevertheless this is a reason-

able approximation of actual performance

0101 – 15

06

Short circuit current will be limited to approximately

RSC

The junction-to-case thermal resistance iJC

specified in the data sheet depends upon the ma-

terial and size of the package die size and thick-

ness and quality of the die bond to the case or

lead frame The case-to-heatsink thermal resist-

ance iCS depends on the mounting of the device

to the heatsink and upon the area and quality of

the contact surface Typical iCS for a TO-3 pack-

age is 0 5 C W to 0 7 C W and 0 3 C W to

0 5 C W using silicone grease

The heatsink to ambient thermal resistance iSA

depends on the quality of the heatsink and the

ambient conditions

10

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