HCTS112D/SAMPLE 데이터 시트보기 (PDF) - Intersil
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HCTS112D/SAMPLE Datasheet PDF : 10 Pages
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Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
K1
(2)
HCTS112MS
HCTS112MS
CP1
(1)
VCC
(16)
J1 (3)
S1 (4)
Q1 (5)
Q1 (6)
(15) R1
(14) R2
(13) CP2
(12) K2
Q2 (7)
(11) J2
(8)
GND
(9)
(10)
Q2
S2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS112 is TA14441A.
Spec Number 518603
498
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