HCTS00D 데이터 시트보기 (PDF) - Intersil

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HCTS00D

Radiation Hardened Quad 2-Input NAND Gate

Intersil 

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20mm x 2.24mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 x 4 mils

Metallization Mask Layout

HCTS00MS

HCTS00MS

B1 (2)

Y1 (3)

A2 (4)

B2 (5)

(12) A4

(11) Y4

(10) B3

(9) A3

Spec Number 518774

377

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