5962F9568901QEC 데이터 시트보기 (PDF) - Intersil
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5962F9568901QEC Datasheet PDF : 4 Pages
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Die Characteristics
DIE DIMENSIONS:
84 mils x 130 mils
(2140µm x 3290µm)
INTERFACE MATERIALS:
Glassivation:
Type: SiO2
Thickness: 10kÅ ± 1kÅ
Metallization Mask Layout
HS-26C32RH
Top Metallization:
M1: Mo/Tiw
Thickness: 5800Å
M2: Al/Si/Cu
Thickness: 5800Å
Worst Case Current Density:
<2.0 x 105A/cm2
Bond Pad Size:
110µm x 100µm
HS-26C32RH
AIN
VDD
BIN
(1)
(16)
(15)
AIN (2)
(14) BIN
AOUT (3)
ENAB (4)
COUT (5)
CIN (6)
(13) BOUT
(12) ENAB
(11) DOUT
(10) DIN
(7)
(8)
(9)
CIN
GND
DIN
4
FN3402.4
August 1, 2008
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