HCTS193D 데이터 시트보기 (PDF) - Intersil
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HCTS193D Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
104 x 86 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS193MS
HCTS193MS
Q1
P1
VCC
(2)
(1)
(16)
Q0(3)
CPD(4)
CPU(5)
Q2(6)
(15) P0
(14) MR
(13) TCD
(12) TCU
Q3(7)
(11) PL
(8)
(9)
(10)
GND
P3
P2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS193 is TA14451A.
Spec Number 518620
600
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