HS-1115RH 데이터 시트보기 (PDF) - Intersil

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HS-1115RH

Radiation Hardened, High Speed, Low Power Output Limiting, Closed-Loop-Buffer Amplifier

Intersil 

Die Characteristics

DIE DIMENSIONS:

59 mils x 58.2 mils x 19 mils ±1 mil

1500μm x 1480μm x 483μm ±25.4μm

METALLIZATION:

Type: Metal 1: AICu(2%)/TiW

Thickness: Metal 1: 8kÅ ±0.4kÅ

Type: Metal 2: AICu(2%)

Thickness: Metal 2: 16kÅ ±0.8kÅ

Metallization Mask Layout

-IN

HS-1115RH

GLASSIVATION:

Type: Nitride

Thickness: 4kÅ ±0.5kÅ

WORST CASE CURRENT DENSITY:

< 2 x 105 A/cm2

TRANSISTOR COUNT: 89

SUBSTRATE POTENTIAL (Powered Up): Floating

HS-1115RH

VH

V+

OUT

+IN

V-

VL

V-

VL

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FN4098.1

4

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