TDA7515 데이터 시트보기 (PDF) - STMicroelectronics
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TDA7515 Datasheet PDF : 7 Pages
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TDA7515
3
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 3. LQFP44 (10x10) Mechanical data & package dimensions
Obsolete
) DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
t(s A
1.60
0.063
c A1 0.05
0.15 0.002
0.006
u A2 1.35 1.40 1.45 0.053 0.055 0.057
d B 0.30 0.37 0.45 0.012 0.015 0.018
ro C 0.09
0.20 0.004
0.008
P D 11.80 12.00 12.20 0.464 0.472 0.480
te D1 9.80 10.00 10.20 0.386 0.394 0.401
le D3
8.00
0.315
o E 11.80 12.00 12.20 0.464 0.472 0.480
bs E1 9.80 10.00 10.20 0.386 0.394 0.401
E3
8.00
0.315
- O e
0.80
0.031
) L 0.45 0.60 0.75 0.018 0.024 0.030
t(s L1
1.00
0.039
c k
0˚(min.), 3.5˚(typ.), 7˚(max.)
Produ ccc
0.10
0.0039
OUTLINE AND
MECHANICAL DATA
LQFP44 (10 x 10 x 1.4mm)
0076922 E
5/7
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