CXG1101TN 데이터 시트보기 (PDF) - Sony Semiconductor
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CXG1101TN Datasheet PDF : 4 Pages
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Package Outline
Unit: mm
10PIN TSSOP(PLASTIC)
∗2.8 ± 0.1
10
6
1.2MAX
0.1
+ 0.15
0.1 – 0.05
SCT Ass'y
1
0.22
5
0.5
0.1 M
0.25
0° to 10°
A
(0.2)
+ 0.08
0.22 – 0.07
DETAIL A
NOTE: “∗” Dimensions do not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
TSSOP-10P-L01
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.02g
10PIN TSSOP(PLASTIC)
∗2.8 ± 0.1
10
6
1.2MAX
0.1
+ 0.15
0.1 – 0.05
1
0.22
5
0.5
0.1 M
0.25
0° to 10°
A
(0.2)
+ 0.08
0.22 – 0.07
DETAIL A
NOTE: “∗” Dimensions do not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
TSSOP-10P-L01
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.02g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
–4–
CXG1101TN
Sony Corporation
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