AD7834 데이터 시트보기 (PDF) - Analog Devices
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AD7834 Datasheet PDF : 28 Pages
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AD7834/AD7835
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. VCC must not exceed VDD by more than
0.3 V. If it is possible for this to happen during power supply sequencing, the diode protection scheme shown in Figure 5 can be used to
provide protection.
Table 5.
Parameter
VCC to DGND
VDD to AGND
VSS to AGND
AGND to DGND
Digital Inputs to DGND
VREF(+) to VREF(–)
VREF(+) to AGND
VREF(–) to AGND
DSG to AGND
VOUT (1–4) to AGND
Operating Temperature Range, TA
Industrial (A Version)
Storage Temperature Range
Junction Temperature, TJ (max)
Power Dissipation, PD (max)
Lead Temperature
Soldering
Rating
−0.3 V to +7 V, or VDD + 0.3 V
(whichever is lower)
−0.3 V to +17 V
+0.3 V to –17 V
−0.3 V to +0.3 V
−0.3 V to VCC + 0.3 V
−0.3 V to +18 V
VSS – 0.3 V to VDD + 0.3 V
VSS – 0.3 V to VDD + 0.3 V
VSS – 0.3 V to VDD + 0.3 V
VSS – 0.3 V to VDD + 0.3 V
−40°C to +85°C
−65°C to +150°C
150°C
(TJ − TA)/θJA
JEDEC Industry Standard
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
VDD
VCC
IN4148
SD103C
VDD
VCC
AD7834/
AD7835
Figure 5. Diode Protection
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
θJA
PDIP
75
SOIC
75
MQFP
95
PLCC
55
Unit
°C/W
°C/W
°C/W
°C/W
ESD CAUTION
Rev. D | Page 7 of 28
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