LX7001CDM 데이터 시트보기 (PDF) - Microsemi Corporation
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LX7001CDM Datasheet PDF : 9 Pages
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LX7001
PRODUCT DATABOOK 1996/1997
TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R A T I N G S (Note 1)
Input Supply Voltage (V ) ............................................................................... -1V to 12V
IN
RESET Output Voltage (VOUT) .......................................................................... -1V to 12V
Output Sink Current (I ) ............................................................ Internally Limited (mA)
OL
Clamp Diode Forward Current (IF), Pin 1 to pin 2 ............................................... 100mA
Operating Junction Temperature
Ceramic (Y - Package) .......................................................................................... 150°C
Plastic (DM, LP - Packages) .................................................................................. 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
T H E R M A L D ATA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
LP PACKAGE:
165°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
Y PACKAGE:
156°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
130°C/W
Junction Temperature Calculation: T = T + (P x θ ).
J
A
D
JA
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
PA C K A G E P I N O U T S
RESET 1
VIN
2
N.C. 3
GROUND 4
8 N.C.
7 N.C.
6 N.C.
5 N.C.
Y PACKAGE
(Top View)
RESET
VIN
N.C.
GROUND
18
27
36
45
N.C.
N.C.
N.C.
N.C.
DM PACKAGE
(Top View)
3. GROUND
2. VIN
1. RESET
LP PACKAGE
(Top View)
2
Copyright © 1999
Rev. 1.2 6/99
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