Die Characteristics
DIE DIMENSIONS
79 mils x 118 mils
2000µm x 3000µm
METALLIZATION
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Metallization Mask Layout
NC
HFA1305
SUBSTRATE POTENTIAL (POWERED UP)
Floating (Recommend Connection to V-)
PASSIVATION
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
TRANSISTOR COUNT
240
HFA1305
NC
OUT3
-IN3
NC
V+
+IN1
+IN3
V-
+IN2
-IN1
OUT1 V-
OUT2
-IN2
10