TDA8170 데이터 시트보기 (PDF) - STMicroelectronics
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TDA8170 Datasheet PDF : 7 Pages
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TDA8170
TYPICAL PERFORMANCES
Parameter
Vs - Supply Voltage
Is - Current
tfly - Flyback Time
Ptot - Power Dissip.
Rth o-a - Heatsink
Tamb
Tj max
To
VI
V7
110 ° TVC
5.9 Ω/10 mH
24
280
0.6
4.2
7
60
110
20
2.5
2.5
110 ° TVC
9.6 Ω/27 mH
22.5
175
1
2.5
13
60
110
20
2.5
2.5
90 ° TVC
15 Ω/30 mH
25
125
0.7
2.05
16
60
110
20
2.5
2.5
Unit
V
mA
ms
W
°C/W
°C
°C
ms
Vpp
Vp
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
Thanks to the HEPTAWATTTM package attaching
the heatsink is very simple, a screw a compression
Figure 4 : Mounting Examples
spring (clip) being sufficient. Between the heatsink
and the packageit isbetter to insert a layerof silicon
grease, to optimize the thermal contact ; no electri-
cal isolation is needed between the two surfaces.
6/7
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