BZX55C27(2010) 데이터 시트보기 (PDF) - Formosa Technology
부품명
상세내역
제조사
BZX55C27 Datasheet PDF : 8 Pages
| |||
Zener Diode
Formosa MS
BZX55C2V4 THRU BZX55C100
BULK PACKING
DEVICE
CASE
TYPE
DO-35G
Q'TY 1
(PCS / BOX)
2,000
INNER
BOX SIZE
(m/m)
96 * 80 * 42
CARTON
SIZE
(m/m)
410 * 335 * 265
Q'TY 2
(PCS / CARTON)
120,000
APPROX.
CROSS
WEIGHT(kg)
17.4
Suggested thermal profiles for soldering processes
1.Lead free temperature profile wave-soldering
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
Peak soldering temperature not
to exceed 260ºC
Peak
Max well
time 5 Max
Preheat
Max gradient 2ºC/s
Cool Down
Max gradient-4ºC/s
Suggested gradient -2ºC/s or
less
20 40 60 80 100 120 140 160 180 200 220 240
Time(Sec)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID Issued Date
DS-222713 2008/02/10
Revised Date Revision
2010/03/10
B
Page.
8
Share Link: 