BGF125 데이터 시트보기 (PDF) - Infineon Technologies

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BGF125

SIM Card Interface Filter and ESD Protection

Infineon Technologies 

BGF125

SIM Card Interface Filter and ESD Protection

BGF125

BGF125 cross talk

0

-20

C1-C2

-40

C1-B3

-60

-80

-100

1

10

100

1000

10000

M Hz

Figure 3 Typical Cross Talk, ZS = ZL = 50 Ω

Package Outlines

Solder balls face down

Solder balls face up

0.6 ±0.05

1.15 ±0.05

B

0.2 ±0.05

STANDOFF

0.1 C

(0.175 ±0.05)

0.4

(0.175 ±0.05)

A

C1

C2

C3

B1

B2

B3

A2

A3

Pin 1

Corner

Index

Area

2)

C

0.08 C

8x

COPLANARITY

2 x 0.4 = 0.8

8x

ø0.05 M A B

0.25 ±0.041)

Figure 4

1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C

2) A1 corner identified by marking

3) Primary datum C and seating plane are defined by the domed crowns of the balls

WLP-8-10-N-PO V02

WLP-8-10 (Wafer Level Package)

Data Sheet

6

V2.0, 2009-04-01

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