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FOD815W 데이터 시트보기 (PDF) - Fairchild Semiconductor

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FOD815W Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Package Dimensions
(Through Hole)
0.200 (5.10)
0.161 (4.10)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.157 (4.00)
0.118 (3.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.110 (2.79)
0.090 (2.29)
0.020 (0.51)
TYP
0.024 (0.60)
0.016 (0.40)
0.300 (7.62)
typ
0.010 (0.26)
Package Dimensions
(Surface Mount)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.051 (1.30)
0.043 (1.10)
0.024 (0.60)
0.004 (0.10)
0.110 (2.79)
0.090 (2.29)
Lead Coplanarity 0.004 (0.10) MAX
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.049 (1.25)
0.030 (0.76)
0.412 (10.46)
0.388 (9.86)
Package Dimensions
(0.4" Lead Spacing)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.024 (0.60)
0.016 (0.40)
0.110 (2.79)
0.090 (2.29)
0.110 (2.80)
0.011 (1.80)
0.42 (10.66)
0.38 (9.66)
Note:
All dimensions are in inches (millimeters)
0.291 (7.40)
0.252 (6.40)
0.010 (0.26)
Footprint Dimensions
(Surface Mount))
1.5
1.3
9
2.54
0.010 (0.26)
5
FOD815 Series Rev. 1.0.4
www.fairchildsemi.com

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