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MAS9124 데이터 시트보기 (PDF) - Micro Analog Systems Oy

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MAS9124
MAS-Oy
Micro Analog Systems Oy MAS-Oy
MAS9124 Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
DA9124.009
11 January 2005
SOLDERING INFORMATION
X For Eutectic Sn/Pb SOT23-5
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20 2*220°C
240°C
3
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
X For Lead-Free TSOT-5 and Lead-Free, RoHS Compliant TSOT-5
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Matte Tin
10 (14)

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