MPX5700(2007) 데이터 시트보기 (PDF) - Freescale Semiconductor
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MPX5700
(Rev.:2007)
(Rev.:2007)
Freescale Semiconductor
MPX5700 Datasheet PDF : 9 Pages
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ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 3 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867).
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the sensor diaphragm. (For use of the
MPX5700D in a high-pressure cyclic application, consult the
factory.)
The MPX5700 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
5.0
4.5 Transfer Function:
Vout = VS*(0.0012858*P+0.04) ± Error
4.0 VS = 5.0 Vdc
3.5 Temperature = 0 to 85°C
3.0
Typical
2.5
Maximum
2.0
Minimum
1.5
1.0
0.5
0
0 100 200 300 400 500 600 700 800
Differential Pressure (kPa)
Figure 2. Output versus Pressure Differential
Fluoro Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Fluoro Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Lead Frame
Epoxy Case
P2
RTV Die
Bond
DIFFERENTIAL/GAUGE ELEMENT
Lead Frame
Epoxy Case
P2
ABSOLUTE ELEMENT
Figure 3. Cross-Sectional Diagrams (not to scale)
+5 V
1.0 µF
Vout
Vs
IPS
0.01 µF
GND
Output
470 pF
RTV Die
Bond
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
Sensors
Freescale Semiconductor
MPX5700
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