STPS340 데이터 시트보기 (PDF) - STMicroelectronics
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STPS340 Datasheet PDF : 11 Pages
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STPS340
Characteristics
Figure 13. Relative variation of thermal
impedance junction to lead
versus pulse duration - SMB flat
Zth(j-l)/Rth(j-l)
1.0
SMB flat
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-04
1.E-03
tp(s)
1.E-02
1.E-01
1.E+00
1.E+01
Figure 14. Reverse leakage current versus
reverse voltage applied (typical
values)
IR(mA)
1.E+01
Tj=150°C
1.E+00
Tj=125°C
Tj=100°C
1.E-01
Tj=75°C
1.E-02
1.E-03
1.E-04
0
Tj=25°C
VR(V)
5
10
15
20
25
30
35
40
Figure 15. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
Figure 16. Forward voltage drop versus
forward current
IFM(A)
10
Tj=125°C
(Maximum values)
1
100
Tj=125°C
(Typical values)
0
Tj=25°C
(Maximum values)
10
1
VR(V)
10
VFM(V)
0
100
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Figure 17.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm) (DPAK)
Rth(j-a)(°C/W)
100
90
DPAK
80
70
60
50
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 18.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm)
(SMB / SMC)
Rth(j-a)(°C/W)
110
100
SMB / SMC
90
80
70
60
50
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
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