EM357 데이터 시트보기 (PDF) - California Eastern Laboratories.

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EM357

MeshConnect™ EM357 Module - Ember EM357 Transceiver Based Module

California Eastern Laboratories. 

MeshConnect™ EM357 Module

TRANSCEIVER IC

The MeshConnect EM357 Module uses the Ember EM357 transceiver IC. This IC incorporates the RF transceiver

with the baseband modem, a hardwired MAC and an embedded ARM® Cortex™-M3 microcontroller, offering an

excellent low cost high performance solution for all IEEE 802.15.4/ZigBee applications.

For more information about the Silicon Laboratories EM357 IC, visit http://www.silabs.com

ADDITIONAL FLASH MEMORY

The MeshConnect EM357 Modules (ZICM357P2-2 and ZICM357P2-2C) incorporates an optional additional 1MB

external Flash memory for OTA program updates. The Flash memory communicates over the EM357’s second

D serial controller using SPI. The Flash memory is wired to the following castellation pins:

E GPIO Name

PA0

D PA1

N N PA2

PA3

E IG WP

Function

SC2MOSI

SC2MISO

SC2SCLK

SC2nSSEL

Flash memory Write Protect line (has internal pull-up

resistor, but not connected to the EM357)

EM357 Module

Pin Number

3

4

5

6

2

The instruction set for the Flash memory is similar to the Micron M25PE80. Note: In order to achieve the specified

M S sleep current for the module, it is necessary to send a Deep Power-Down command to the Flash memory.

See http://www.micron.com for more information on the instruction set.

M E ANTENNA

The MeshConnect EM357 Module includes an integrated Printed Circuit Board (PCB) trace antenna. An optional

O D U.FL connector can be specified, providing connection to a 50-ohm external antenna of the user’s choice. However,

use of an external antenna is not covered by the module's certification; see Ordering Information on Page 1.

C For optimum antenna performance, the MeshConnect EM357 Module should be mounted with the PCB trace

E W antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed

on the host board under the module up to the antenna. The installation of an uninterrupted ground plane on a

E layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance

R with your PCB layout.

N The PCB antenna employs an Inverted F-Antenna topology that is compact and highly efficient. To maximize

T range, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on

the host PCB will contribute significantly to the antenna performance; it should not be directly under the Inverted

O R F-Antenna. The position of the module on the host board and overall design of the product enclosure contribute

to antenna performance. Poor design affects radiation patterns and can result in reflection, diffraction and/or

N O scattering of the transmitted signal.

F A few design guidelines to help ensure antenna performance:

• Never place the ground plane or route copper traces directly underneath the antenna portion of the module

• Never place the antenna close to metallic objects

• In the overall design, ensure that wiring and other components are not placed near the antenna

• Do not place the antenna in a metallic or metalized plastic enclosure

• Keep plastic enclosures 1cm or more away from the antenna in any direction

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