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ACPL-214 데이터 시트보기 (PDF) - Avago Technologies

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ACPL-214 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Solder Reflow Temperature Profile
250 °C
217 °C
200 °C
30 seconds
260 °C (Peak Temperature)
150 °C
60 sec
25 °C
60 ~ 150 sec
90 sec
Time (sec)
60 sec
1. One-time soldering reflow is recommended within the
condition of temperature and time profile shown at
right.
2. When using another soldering method such as
infrared ray lamp, the temperature may rise partially
in the mold of the device. Keep the temperature on
the package of the device within the condition of (1)
above.
Note: Non halide flux should be used.
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Average Forward Current
Pulse Forward Current
LED Power Dissipation
Collector Current
Collector-Emitter Voltage
Emitter-Collector Voltage
Isolation Voltage (AC for 1min, R.H.
40~60%)
Collector Power Dissipation
Total Power Dissipation
Lead Solder Temperature
Symbol
TS
TA
IF(AVG)
IFSM
PI
IC
VCEO
VECO
VISO
ACPL-214
-55~125
-55~110
±50
±1
65
50
80
7
3000
Units
°C
°C
mA
A
mW
mA
V
V
VRMS
PC
150
mW
PTOT
200
mW
260°C for 10 sec., 1.6 mm below seating plane
Note
1min


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