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STPS30H100 데이터 시트보기 (PDF) - STMicroelectronics

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STPS30H100
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STPS30H100 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
STPS30H100C
2
Package information
Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.4 to 0.6 N·m (TO-220AB), 0.55 N·m (TO-247)
Maximum torque value: 1.0 N·m (TO-247)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5. TO-247 dimensions
Dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ Max.
S
D
L1
L
E
R
L2
b1
b2
123 b
e
A
Heat-sink plane
P
c
3 21
A1
BACK VIEW
A 4.85
5.15 0.191
0.203
A1 2.20
2.60 0.086
0.102
b 1.00
1.40 0.039
0.055
b1 2.00
2.40 0.078
0.094
b2 3.00
3.40 0.118
0.133
c 0.40
D(1) 19.85
0.80 0.015
20.15 0.781
0.031
0.793
E 15.45
15.75 0.608
0.620
e 5.30 5.45 5.60 0.209 0.215 0.220
L 14.20
14.80 0.559
0.582
L1 3.70
4.30 0.145
0.169
L2
18.50 typ.
0.728 typ.
P(2) 3.55
3.65 0.139
0.143
R 4.50
5.50 0.177
0.217
S 5.30 5.50 5.70 0.209 0.216 0.224
1. Dimension D plus gate protrusion does not exceed 20.5 mm
2. Resin thickness around the mounting hole is not less than 0.9 mm
Doc ID 6347 Rev 8
5/10

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