SSD1854U 데이터 시트보기 (PDF) - Solomon Systech

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SSD1854U

LCD Segment / Common Driver with Controller CMOS

Solomon Systech  

5

DIE Arrangement

Pad171

Pad324

COM67

COM66

COM65

COM64

COM63

COM62

COM61

COM60

:

:

:

:

:

:

:

:

:

:

COM2

COM1

COM0

SEG0

SEG1

SEG2

SEG3

SEG4

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

SEG78

SEG79

SEG80

SEG81

SEG82

SEG83

SEG84

SEG85

COM110

CCOOMM111112

COM113

COM114

:

:

::

:

:

::

:

:

:

:

::

:

:

::

:

:

COM155

COM156

CCOOMM115578

COM159

VSS

VSS

N/C

CDN

CDP

CCN

CCP

CCBBNP

CAN

CAP

VL7

VL6

VL5

VL4

VL3

VL2

VVSSSS

N/C

VDD

VEXT

REF

ADVVSSSS

VSS

C4P

CC22NP

C1P

C1N

C3P

VCC

VVSSSS

VCI

AVDD

DDV15DD

D14

D13

D12

D11

DD910

D8

D7(SDA)

D6(SCK)

D5

D4

D3

D2

D1

DVD0 D

E(RD#)

R/W(WR#)

VSS

D/C

RES#

VDD

CS#

N/C

VPSS1S

VDD

VSS

PS2

PS0

ONS/CC1

VDD

N/C

NN//CC

N/C

Pad126

Note:

1. Diagram showing the die face up.

2. Coordinates are reference to center

of the chip.

3. Unit of coordinates and Size of all

alignment marks are in um.

4. All alignment keys do not contain

gold bump.

Chip Size

X

10.72

Y

Unit

2.77 mm

Chip

Thickness

723.9 ± 25

µm

Pad #

XY

1–4

43 – 51

59 – 75 40 70

77 – 126

Bump Size 171 – 324

µm

5 – 42

52 – 58

76

50 60

127 – 170

325 – 368

70

40

Bump

Height

18 (Typ.)

µm

Pad1

SSD1854

Series

Rev 1.0

08/2002

Figure 2 – SSD1854Z Pin Assignment

4

SOLOMON

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