33981B 데이터 시트보기 (PDF) - Freescale Semiconductor

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33981B

Single High Side Switch (4.0 mΩ), PWM clock up to 60 kHz

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Unit

ELECTRICAL RATINGS

Power Supply Voltage

Steady-state

Input/Output Pins Voltage(1)

Output Voltage

Positive

Negative

Continuous Output Current(2)

CSNS Input Clamp Current

EN Input Clamp Current

SR Voltage

CBOOT Voltage

OCLS Voltage

Low Side Gate Voltage

Low Side Drain Voltage

ESD Voltage(3)

Human Body Model (HBM)

Charge Device Model (CDM)

Corner Pins (1, 12, 15, 16)

All Other Pins (2-11, 13-14)

VPWR

V

-16 to 41

INHS, INLS,

- 0.3 to 7.0

V

CONF, CSNS, FS,

TEMP, EN

VOUT

V

41.0

-5.0

IOUT

40.0

A

ICL(CSNS)

15.0

mA

ICL(EN)

2.5

mA

VSR

- 0.3 to 54.0

V

CBOOT

- 0.3 to 54.0

V

VOCLS

- 5.0 to 7.0

V

VGLS

- 0.3 to 15.0

V

VDLS

- 5.0 to 41.0

V

VESD

V

± 2000

± 750

± 500

THERMAL RATINGS

Operating Temperature

Ambient

Junction

°C

TA

- 40 to 125

TJ

- 40 to 150

Storage Temperature

Thermal Resistance(4)

Junction to Power Die Case

Junction to Ambient

Peak Package Reflow Temperature During Reflow(5), (6)

TSTG

RθJC

RθJA

TPPRT

- 55 to 150

1.0

30.0

Note 6

°C

°C/W

°C

Notes

1. Exceeding voltage limits on INHS, INLS, CONF, CSNS, FS, TEMP, and EN pins may cause a malfunction or permanent damage to the

device.

2. Continuous high side output rating as long as maximum junction temperature is not exceeded. Calculation of maximum output current

using package thermal resistance is required.

3. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω) and the Charge Device

Model (CDM), Robotic (CZAP = 4.0 pF).

4. Device mounted on a 2s2p test board per JEDEC JESD51-2.

5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

33981

4

Analog Integrated Circuit Device Data

Freescale Semiconductor

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