MC34653EF 데이터 시트보기 (PDF) - Freescale Semiconductor
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MC34653EF Datasheet PDF : 24 Pages
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
Power MOSFET Energy Capability
Continuous Output Current (2)
Maximum Voltage
DISABLE Pin
ILIM and ICHG Pins
PG Pin (VPG - VIN)
PG Pin (VPG - VIN)
All Pins Minimum Voltage
PG, PG Maximum Current
ESD Voltage, All Pins (3)
Human Body Model
Machine Model
VPWR
85
V
EMOSFET
Varies (1)
mJ
IO (CONT)
1.0
A
V
—
VIN - 0.3 to VPWR + 5.5
—
5.0
—
85
—
85
—
- 0.3
V
—
Internally Limited
A
V
VESD3
± 2000
VESD4
± 200
THERMAL RATINGS
Storage Temperature
Operating Temperature
Ambient (4)
Junction
Peak Package Reflow Temperature During Reflow (5), (6)
Thermal Resistance (7) , (8)
Junction-to-Ambient, Single-Layer Board (9)
Junction-to-Ambient, Four-Layer Board (10)
TSTG
TA
TJ
TPPRT
RθJA
RθJMA
- 65 to 150
- 40 to 85
- 40 to 160
Note 6
167
115
°C
°C
°C
°C/W
Notes
1. Refer to the section titled Power MOSFET Energy Capability on page 21 for a detailed explanation on this parameter.
2. Continuous output current capability so long as TJ is ≤ 160°C.
3. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
4. The limiting factor is junction temperature, taking into account power dissipation, thermal resistance, and heatsinking.
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
7. Refer to the section titled Thermal Shutdown on page 15 for more thermal resistance values under various conditions.
8. The VOUT and VIN pins comprise the main heat conduction paths.
9. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
10. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the
board.
34653
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
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