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HT48C30 데이터 시트보기 (PDF) - Holtek Semiconductor

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HT48C30
Holtek
Holtek Semiconductor Holtek
HT48C30 Datasheet PDF : 59 Pages
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HT48CXX/HT48RXX
Note: For the dice form, the TMR0 and TMR1 pads have to be bonded to VDD or VSS if the TMR0
and/or TMR1 pad are not used.
The (TMR0) INT indicates that the TMR0 pad should be bonded to the INT pin.
The PC5 (TMR1) indicates that the TMR1 pad should be bonded to the PC5 pin.
5
25th May ’99

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