IDT6167LA55YB 데이터 시트보기 (PDF) - Integrated Device Technology
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IDT6167LA55YB Datasheet PDF : 8 Pages
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IDT6167SA/LA
CMOS STATIC RAM 16K (16K x 1-BIT)
AC TEST CONDITIONS
Input Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
AC Test Load
GND to 3.0V
5ns
1.5V
1.5V
See Figures 1 and 2
2981 tbl 10
5V
DATAOUT
255Ω
480Ω
30pF*
MILITARY AND COMMERCIAL TEMPERATURE RANGES
DATAOUT
255Ω
5V
480Ω
5pF*
2981 drw 04
Figure 1. AC Test Load
*Includes scope and jig.
2981 drw 05
Figure 2. AC Test Load
(for tCLZ, tCHZ, tWHZ and tOW)
AC ELECTRICAL CHARACTERISTICS (VCC = 5.0V ± 10%, All Temperature Ranges)
6167SA15 6167SA20/25 6167SA35/45(1) 6167SA55(1)/70(1)
6167LA15 6167LA20/25 6167LA35/45(1) 6167LA55(1)/70(1)
Symbol
Parameter
Min. Max. Min. Max. Min. Max. Min. Max. Unit
Read Cycle
tRC
Read Cycle Time
15 — 20/25 — 35/45 — 55/70 — ns
tAA
Address Access Time
— 15
— 20/25 — 35/45 — 55/70 ns
tACS
tCLZ(2)
tCHZ(2)
Chip Select Access Time
Chip Deselect to Output in Low-Z
Chip Select to Output in High-Z
— 15
— 20/25 — 35/45 — 55/70 ns
3 — 5/5 — 5/5 — 5/5 — ns
— 10
— 10/10 — 15/30 — 40/40 ns
tOH
tPU(2)
tPD(2)
Output Hold from Address Change
Chip Select to Power-Up Time
Chip Deselect to Power-Down Time
3 — 5/5 — 5/5 — 5/5 — ns
0 — 0/0 — 0/0 — 0/0 — ns
— 15
— 20/25 — 35/45 — 55/70 ns
Write Cycle
tWC
Write Cycle Time
15 — 20/20 — 30/45 — 55/70 — ns
tCW
Chip Select to End-of-Write
15 — 15/20 — 30/40 — 45/55 — ns
tAW
Address Valid to End-of-Write
15 — 15/20 — 30/40 — 45/55 — ns
tAS
Address Set-up Time
0 — 0/0 — 0/0 — 0/0 — ns
tWP
Write Pulse Width
13 — 15/20 — 30/30 — 35/40 — ns
tWR
Write Recovery Time
0 — 0/0 — 0/0 — 0/0 — ns
tDW
Data Valid to End-of-Write
10 — 12/15 — 17/20 — 25/30 — ns
tDH
tWHZ(2)
tOW(2)
Data Hold Time
Write Enable to Output in High-Z
Output Active from End-of-Write
0 — 0/0 — 0/0 — 0/0 — ns
—7
— 8/8 — 15/30 — 40/40 ns
0 — 0/0 — 0/0 — 0/0 — ns
NOTES:
1. –55°C to +125°C temperature range only. Also available: 85ns and 100ns Military devices.
2. This parameter is guaranteed with AC Load (Figure 2) by device characterization, but is not production tested.
2981 tbl 11
5.2
5
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