MCRF450 데이터 시트보기 (PDF) - Microchip Technology

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MCRF450

13.56 MHz Read/Write Passive RFID Device

Microchip Technology 

MCRF450/451/452/455

FIGURE 2-1:

MCRF450/451/452/455 DIE LAYOUT

Top View

Y

(Notch edge of wafer)

1590.6

FCLK

865.2

VDD

1037.6

Vss

900.1

CLK

X

1071.5

Ant. A

Ant. B

Note:

1613

Coordinate units are in µm.

See Table 2-5 for die mechanical dimensions.

Die size before saw:

1904.0 µm x 2340.8 µm

1.904 mm x 2.3408 mm

74.96 mil x 92.16 mil

Die size after saw:

1840.5 µm x 2277.3 µm

1.8405 mm x 2.2773 mm

72.46 mil x 89.66 mil

Bond pad size:

89 µm x 89 µm

0.089 mm x 0.089 mm

3.5 mil x 3.5 mil

Bumped die:

Bumped Pad: Four corner pads (FCLK, VSS, Antenna B, Antenna A)

Bumping Material: 99.6% Gold

Bump Height: 25 µm ±3 µm

Bump Size: 103 µm x 103 µm (Covered all passivation opening of bond pad)

Other area except the four bumped pads: Covered by Polyamide

Thickness of Polyamide: 3 µm

DS40232H-page 8

 2003 Microchip Technology Inc.

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