MMG3002NT1 데이터 시트보기 (PDF) - Motorola => Freescale

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MMG3002NT1

Heterojunction Bipolar Transistor Technology (InGaP HBT)

Motorola => Freescale 

Freescale Semiconductor, Inc.

1.7

7.62

0.305 diameter

3.48

5.33

1.27

0.58

0.86

0.64

3.86

Recommended Solder Stencil

2.49

1.27

2.54

NOTES:

1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE

USED IN PCB LAYOUT DESIGN.

2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS

POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.

3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN

AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO

THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL

AND RF PERFORMANCE.

4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM

PITCH.

Figure 22. Recommended Mounting Configuration

MOTOROLA RF DEVICE DATA

For More Information On This Product,

Go to: www.freescale.com

MMG3002NT1

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